2018年IEEE大数据与智能计算国际会议

2018年IEEE大数据与智能计算国际会议

2018年1月15日 至 17日已结束 中国 - 上海 上海市杨浦区
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[ 会议基本信息 ]
会议名称(中文):2018年IEEE大数据与智能计算国际会议
会议名称(英文):2018 IEEE International Conference on Big Data and Smart Computing
所属学科:计算机应用技术,计算机网络,人工智能
开始日期2018-01-15
结束日期:2018-01-17
所在国家:中华人民共和国
所在城市:上海市   杨浦区
具体地点:
主办单位:KIISE
协办单位:
承办单位:复旦大学
议题:
Big Data and Smart Computing
[ 组织结构 ]
会议主席王晓阳 (复旦大学)
组织委员会主席:
程序委员会主席:杜军平(北京邮电大学)
会议嘉宾:
姓名 职务 简介 演讲题目
[ 重要日期 ]
摘要截稿日期:2017-07-31
全文截稿日期:2017-07-31
论文录用通知日期:2017-10-30
交修订版截至日期:2017-11-15
[ 组织结构 ]
联系人徐敬楠
联系电话:021-51355555-19
传真021-51355558
E-MAIL:xujn@fudan.edu.cn
通讯地址上海张衡路825号计算机学院
邮政编码201203
会议注册费
会议网站http://www.bigcomputing.org/
会议背景介绍:
Big data and smart computing are emerging research fields that have recently drawn much attention from computer science and information technology as well as from social sciences and other disciplines. The goal of the International Conference on Big Data and Smart Computing (BigComp), initiated by KIISE (Korean Institute of Information Scientists and Engineers), is to provide an international forum for exchanging ideas and information on current studies, challenges, research results, system developments, and practical experiences in these emerging fields. Following the successes of the previous BigComp conferences in Bangkok, Thailand (2014), Jeju, Korea (2015), Hong Kong, China (2016), Jeju, Korea (2017), the 2018 International Conference on Big Data and Smart Computing (BigComp 2018) will be held in Shanghai, China. The conference is co-sponsored by IEEE and KIISE. BigComp 2018 invites authors to submit original research papers and original work-in-progress reports on big data and smart computing.
征文范围要求
Relevant TopicsTechniques, models and algorithms for big dataTools and systems for big dataData mining, graph mining and data scienceInfrastructure and platform for smart computingBig data analytics and social mediaHardware/software infrastructure for big dataMobile communications and networksMachine learning and AI for big dataWeb search and information retrievalModels and tools for smart computingCloud and grid computing for big dataSecurity and privacy for big dataSmart devices and hardwareBig data applications: Bioinformatics, Multimedia,  Smartphones, etc.SubmissionPapers must be formatted in PDF according to the IEEE two-column format for conference proceedings and submitted through CMT. The direct link for paper submission is https://cmt3.research.microsoft.com/BC2018/.Papers can be either regular or short papers, where regular papers are limited to 8 pages and short ones to 4 pages. Details about the submission process including formatting instructions are at the conference website. Important DeadlinesWorkshop proposal submission: June 30, 2017Full paper submission: July 31, 2017Tutorial proposal submission: August 30, 2017Acceptance notification: October 30, 2017Camera-ready copies: November 15, 2017Author registration: November 20, 2017Early registration: December 15, 2017Conference dates: January 15-17, 2018
会议主席:王晓阳 (复旦大学)
组织委员会主席:
程序委员会主席:杜军平(北京邮电大学)
会议嘉宾:
姓名 职务 简介 演讲题目
[ 重要日期 ]
摘要截稿日期:2017-07-31
全文截稿日期:2017-07-31
论文录用通知日期:2017-10-30
交修订版截至日期:2017-11-15
[ 会务组联系方式 ]
[ 重要日期 ]
联系人:徐敬楠
联系电话:021-51355555-19
传真:021-51355558
E-MAIL:xujn@fudan.edu.cn
通讯地址:上海张衡路825号计算机学院
邮政编码:201203
会议注册费:
会议网站:http://www.bigcomputing.org/
会议背景介绍:
Big data and smart computing are emerging research fields that have recently drawn much attention from computer science and information technology as well as from social sciences and other disciplines. The goal of the International Conference on Big Data and Smart Computing (BigComp), initiated by KIISE (Korean Institute of Information Scientists and Engineers), is to provide an international forum for exchanging ideas and information on current studies, challenges, research results, system developments, and practical experiences in these emerging fields. Following the successes of the previous BigComp conferences in Bangkok, Thailand (2014), Jeju, Korea (2015), Hong Kong, China (2016), Jeju, Korea (2017), the 2018 International Conference on Big Data and Smart Computing (BigComp 2018) will be held in Shanghai, China. The conference is co-sponsored by IEEE and KIISE. BigComp 2018 invites authors to submit original research papers and original work-in-progress reports on big data and smart computing.
征文范围及要求:
Relevant TopicsTechniques, models and algorithms for big dataTools and systems for big dataData mining, graph mining and data scienceInfrastructure and platform for smart computingBig data analytics and social mediaHardware/software infrastructure for big dataMobile communications and networksMachine learning and AI for big dataWeb search and information retrievalModels and tools for smart computingCloud and grid computing for big dataSecurity and privacy for big dataSmart devices and hardwareBig data applications: Bioinformatics, Multimedia,  Smartphones, etc.SubmissionPapers must be formatted in PDF according to the IEEE two-column format for conference proceedings and submitted through CMT. The direct link for paper submission is https://cmt3.research.microsoft.com/BC2018/.Papers can be either regular or short papers, where regular papers are limited to 8 pages and short ones to 4 pages. Details about the submission process including formatting instructions are at the conference website. Important DeadlinesWorkshop proposal submission: June 30, 2017Full paper submission: July 31, 2017Tutorial proposal submission: August 30, 2017Acceptance notification: October 30, 2017Camera-ready copies: November 15, 2017Author registration: November 20, 2017Early registration: December 15, 2017Conference dates: January 15-17, 2018
摘要截稿日期:2017-07-31
全文截稿日期:2017-07-31
论文录用通知日期:2017-10-30
交修订版截至日期:2017-11-15
[ 会务组联系方式 ]
[ 会务组联系方式 ]
联系人:徐敬楠
联系电话:021-51355555-19
传真:021-51355558
E-MAIL:xujn@fudan.edu.cn
通讯地址:上海张衡路825号计算机学院
邮政编码:201203
会议注册费:
会议网站:http://www.bigcomputing.org/
会议背景介绍:
Big data and smart computing are emerging research fields that have recently drawn much attention from computer science and information technology as well as from social sciences and other disciplines. The goal of the International Conference on Big Data and Smart Computing (BigComp), initiated by KIISE (Korean Institute of Information Scientists and Engineers), is to provide an international forum for exchanging ideas and information on current studies, challenges, research results, system developments, and practical experiences in these emerging fields. Following the successes of the previous BigComp conferences in Bangkok, Thailand (2014), Jeju, Korea (2015), Hong Kong, China (2016), Jeju, Korea (2017), the 2018 International Conference on Big Data and Smart Computing (BigComp 2018) will be held in Shanghai, China. The conference is co-sponsored by IEEE and KIISE. BigComp 2018 invites authors to submit original research papers and original work-in-progress reports on big data and smart computing.
征文范围及要求:
Relevant TopicsTechniques, models and algorithms for big dataTools and systems for big dataData mining, graph mining and data scienceInfrastructure and platform for smart computingBig data analytics and social mediaHardware/software infrastructure for big dataMobile communications and networksMachine learning and AI for big dataWeb search and information retrievalModels and tools for smart computingCloud and grid computing for big dataSecurity and privacy for big dataSmart devices and hardwareBig data applications: Bioinformatics, Multimedia,  Smartphones, etc.SubmissionPapers must be formatted in PDF according to the IEEE two-column format for conference proceedings and submitted through CMT. The direct link for paper submission is https://cmt3.research.microsoft.com/BC2018/.Papers can be either regular or short papers, where regular papers are limited to 8 pages and short ones to 4 pages. Details about the submission process including formatting instructions are at the conference website. Important DeadlinesWorkshop proposal submission: June 30, 2017Full paper submission: July 31, 2017Tutorial proposal submission: August 30, 2017Acceptance notification: October 30, 2017Camera-ready copies: November 15, 2017Author registration: November 20, 2017Early registration: December 15, 2017Conference dates: January 15-17, 2018
联系人:徐敬楠
联系电话:021-51355555-19
传真:021-51355558
E-MAIL:xujn@fudan.edu.cn
通讯地址:上海张衡路825号计算机学院
邮政编码:201203
会议注册费:
会议网站:http://www.bigcomputing.org/
会议背景介绍:
Big data and smart computing are emerging research fields that have recently drawn much attention from computer science and information technology as well as from social sciences and other disciplines. The goal of the International Conference on Big Data and Smart Computing (BigComp), initiated by KIISE (Korean Institute of Information Scientists and Engineers), is to provide an international forum for exchanging ideas and information on current studies, challenges, research results, system developments, and practical experiences in these emerging fields. Following the successes of the previous BigComp conferences in Bangkok, Thailand (2014), Jeju, Korea (2015), Hong Kong, China (2016), Jeju, Korea (2017), the 2018 International Conference on Big Data and Smart Computing (BigComp 2018) will be held in Shanghai, China. The conference is co-sponsored by IEEE and KIISE. BigComp 2018 invites authors to submit original research papers and original work-in-progress reports on big data and smart computing.
征文范围及要求:
Relevant TopicsTechniques, models and algorithms for big dataTools and systems for big dataData mining, graph mining and data scienceInfrastructure and platform for smart computingBig data analytics and social mediaHardware/software infrastructure for big dataMobile communications and networksMachine learning and AI for big dataWeb search and information retrievalModels and tools for smart computingCloud and grid computing for big dataSecurity and privacy for big dataSmart devices and hardwareBig data applications: Bioinformatics, Multimedia,  Smartphones, etc.SubmissionPapers must be formatted in PDF according to the IEEE two-column format for conference proceedings and submitted through CMT. The direct link for paper submission is https://cmt3.research.microsoft.com/BC2018/.Papers can be either regular or short papers, where regular papers are limited to 8 pages and short ones to 4 pages. Details about the submission process including formatting instructions are at the conference website. Important DeadlinesWorkshop proposal submission: June 30, 2017Full paper submission: July 31, 2017Tutorial proposal submission: August 30, 2017Acceptance notification: October 30, 2017Camera-ready copies: November 15, 2017Author registration: November 20, 2017Early registration: December 15, 2017Conference dates: January 15-17, 2018

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